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Direct Bond Copper DBC Ceramic Substrate , Aluminum Nitride Substrate

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Direct Bond Copper DBC Ceramic Substrate , Aluminum Nitride Substrate

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Brand Name :	OEM
Model Number :	Customized
Supply Ability :	2000 Piece/Pieces per Day
Price :	Negotiable
Certification :	RoHS, REACH, ISO

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Direct Bond Copper DBC Ceramic Substrate , Aluminum Nitride Substrate

Direct Bond Copper Alumina Metallized Ceramic DBC Substrate For Power Electronics

Why choose us?

1. Support custom made metalized ceramic substrates, whatever, it's prototyping project, or cost down.

2. With over 15 years of OEM, ODM manufacturing experience.

3. With in-house comprehensive production equipment from forming to the secondary process.

4. Competitive price with low-level MOQ request.

5. Free samples availability for stocked alumina metalized ceramic substrate.

Product Description

Specification:

1. Conventional thickness: 0.5mm, 0.635mm and 1mm

2. Customized thickness, different width, and length are available.

3. Color: White, pink optional

4. OEM, ODM are welcomed.

Prime features :

1. Excellent thermal cycle properties

2. High thermal conductivity

3. High-density, high electrical insulation, low electricity loss,

4. Good anti-corrosion properties

5. Small dielectric constant

6. High mechanical strength.

Application:

widely used in thick film circuits large-scale integrated circuits, hybrid IC, semiconductor packages, chip resistors, networks resistor, focusing potentiometer, power modules, power hybrid circuits and other related fields of electronic industry

Material Data. Sheet

Items	Unit	95% alumina	99.2% alumina	99.5% alumina	ZrO2 (Y-TZP)	SiC	TiO2	Si3N4
Color		White	Ivory	Ivory	White	Black	Black	Gray
Density	g/cm3	≥3.60	≥3.80	≥3.85	≥6.0	≥3.21	≥4.00	3.22
Water absorption	%	0	0	0	0	0	0	0
Hardness	HV	1500	1700	1700	1300	2500	800
Flexural strength	Mpa	≥320	≥338	≥379	1200	550	158	650
Compressive strength	Mpa	≥2000	≥2240	≥2240	≥1990	≥3306	---	≥2200
Max. service temperature (Non-loading)	℃	1550	1600	1675	850	1600	1000	1200
Thermal conductivity	W/(m.K)	24	29	30	2.5	150	5	25
Volume resistivity	Ω.cm	> 10^14	> 10^14	> 10^14	> 10^11	10^5	10^12	> 10^14
Insulation strength	kV/mm	18	18	19	17	---	3.93	16
Dielectric constant	-	9.5	9.5	9.7	29	---	95	8.2

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Direct Bond Copper DBC Ceramic Substrate , Aluminum Nitride Substrate

Company Profile

Direct Bond Copper DBC Ceramic Substrate , Aluminum Nitride Substrate

FAQ

Q1. Is it available to provide customize products?

A: We always support custom-made metalized ceramic substrate as per different dimensions, design and metallization and plating.

Q2. When can I get the price?

A: We regularly quote within 24 hours after we get your inquiry. If you are in urgent need of getting the price, please call us or tell us in your email so that we will proceed with your inquiry as a priority.

Q3. How long can I expect to get the sample?
A: After you pay the sample charge and send us confirmed files, the samples will be ready for delivery in 4 weeks. The samples will be sent to you via express and arrive in 3-5 workdays. You can use your own express account or prepay us if you do not have an account.
Q4. How long does the whole procedure being worked out?
A: After you place an order, the manufacturing time is about 25 working days.

Q5. How to ensure quality?

A: The dimension out of any batch will be carried out sampling inspection per International AQL standard. A 100% cosmetic inspection will be done.

Q6. Are you a factory or trading company?
A: We are a professional manufacturer. We are warmly welcome clients from worldwide to visit our factory and cooperate with us.

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